Generic hybrid FPA with indium bump bonds [7].
Emerging fine-pitch bump bonding techniques - ppt video online
Progress on AlGaN-based solar-blind ultraviolet photodetectors and
Intrinsic efficiency versus incident photon energy in a PSF with 1 mm
AlGaAs/GaAs Quantum Well Infrared Photodetectors
Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places
Generic hybrid FPA with indium bump bonds [7].
nBn extended short-wavelength infrared focal plane array
Die-to-Wafer Bonding - SET
Remote Sensing, Free Full-Text
Advances in Infrared Detector Array Technology
Hybrid UV Focal Plane Array (FPA), consisting of a back
Christina L. Howe's research works Vanderbilt University, TN (Vander Bilt) and other places
Intrinsic efficiency versus incident photon energy in a PSF with 1 mm
Christina L. Howe's research works Vanderbilt University, TN (Vander Bilt) and other places
Analysis on Structural Stress of 64 × 64 InSb IRFPAs with
